Capabilities

Limitation Definition

Limit

General

Maximum drill diameter. 6.30
Minimum drill diameter. 0.20
Maximum router cutter diameter. 3.175
Minimum router cutter diameter. 0.60
Positional accuracy of a drilled hole relative to intended position. ±0.050
Positional accuracy of a routed edge relative to intended position. ±0.050
Cumulative tolerance incurred due to subsequent set-up. ±0.050
Diameter tolerance (non-plated holes.) ±0.025
Maximum material length. 609.60
Minimum material length. 203.20
Maximum material width. 457.20
Minimum material width. 203.20
Maximum material thickness. 5.000
Minimum material thickness. 0.050
Smallest hole diameter capable of being plated. 0.200
Maximum plating thickness. 70um
Minimum plating thickness. 3um
Minimum plating thickness increment. 1um
Maximum panel length. 609.60
Minimum panel length. 203.20
Maximum panel width. 457.20
Minimum panel width. 203.20
Maximum panel thickness. 5.000
Minimum panel thickness. 0.050
Minimum feature width 18um Copper. 0.075
" " " 35um Copper. 0.100
" " " 70um Copper. 0.150
Minimum spacing 18um Copper. 0.075
" " 35um Copper. 0.100
" " 70um Copper. 0.150
Positional accuracy of printed image relative to intended position. ±0.050

Covercoat / Covercoat Bond

Minimum clearance from Copper to ensure no encroachment. 0.075
Minimum encapsulation to ensure no exposed copper. 0.100
Minimum remaining web between apertures. 0.100
Minimum distance to board edge. 0.250
Maximum panel length. 609.60
Minimum panel length. 203.20
Maximum panel width. 457.20
Minimum panel width. 203.20
Maximum panel thickness. 5.000
Minimum panel thickness. 0.050

Liquid Photo-Imageable Solder Mask (LPISM)

Minimum clearance from Copper to ensure no encroachment. 0.075
Minimum encapsulation to ensure no exposed copper. 0.075
Minimum remaining web between apertures. 0.100
Minimum distance to board edge or non-plated hole. 0.075
Maximum panel length. 609.60
Minimum panel length. 203.20
Maximum panel width. 457.20
Minimum panel width. 203.20
Maximum panel thickness. 5.000
Minimum panel thickness. 0.050

Screen Printed Inks

Minimum clearance from Copper to ensure no encroachment. 0.250
Minimum distance to board edge or non-plated hole. 0.250
Minimum feature width. 0.150
Peelable mask thickness. 1.000
Maximum hole diameter for tenting with peelable mask. 2.500
Maximum panel length. 609.60
Minimum panel length. 203.20
Maximum panel width. 457.20
Minimum panel width. 203.20
Maximum panel thickness. 5.000
Minimum panel thickness. 0.050

SRD Profile

Maximum material thickness. 0.600
Positional accuracy of any cut edge relative to tooling holes. ±0.100
Minimum gap between cuts. 2.000
Minimum internal radius. 0.500
Tooling hole diameter. 3.175
Minimum number of tooling holes per cut image. 3

Hard Tool Profile

Maximum material thickness. 1.60
Positional accuracy of any cut edge relative to tooling holes. ±.050
Minimum gap between cuts. 2.50
Minimum internal radius. 0.500
Tooling hole diameter. 3.175
Minimum number of tooling holes per cut image. 3

Electrical Test (Universal Grid)

Maximum board size - double sided test 609.60
Maximum isolation test voltage 250 V
Maximum isolation threshold 50 Mohm
Minimum continuity threshold 5 Ohm
Minimum feature pitch 0.50 0.30
Minimum feature size X,Y 0.30 x 0.30
Minimum number of location holes per image 2
Minimum location hole diameter 1.50
Maximum location hole diameter 5.40

Electrical Test (Flying Probe)

Maximum board size - doube sided test 609.60
Maximum isolation test voltage 250 V
Maximum isolation threshold 50 Mohm
Minimum continuity threshold 5 Ohm
Minimum feature pitch 0.150
Minimum feature size X,Y 0.150 x 0.150