Single-Sided flexible circuits are the simplest and cheapest form of flexible interconnection system, with copper conductors on one side of a polyimide base film. The interconnection can be made through zero insertion force connector systems (ZIF), surface-mount or through-hole connector systems, crimp contacts, or simply by direct soldering (Hot-Bar Reflow.)

These circuits are produced from a drilled flexible base laminate, which is then image exposed and chemical etched. The tracking is then encapsulated with either a polyimide covercoat or a flexible photo-imageable solder resist.

Polyimide stiffeners, epoxy rigidisers, and/or aluminium plates can be added to reinforce, or to increase thickness in selective areas of the circuit.

Single-sided flexible circuits can be profiled by either soft tooling (steel rule die) or hard tooling (compound press tool), they can also be part profiled and supplied in a biscuit array.

A range of organic or metallic finishes can be applied depending on the end application such as tin/lead, electroless nickel/immersion gold, electrolytic nickel & gold, silver, palladium etc….

Double-Sided flexible circuits allow copper conductors to be routed on both sides of a polyimide base film. The double-sided flexible base laminate is drilled at the first stage with vias, component, thru’ and tooling holes. The panel is then Electro-copper plated to achieve a through hole connection. The panel is image exposed on both sides (the dry-film photo-resist ‘tents’ the plated holes) and then chemical etched. The tracking is then encapsulated with either a polyimide covercoat and/or a flexible photo-imageable solder resist.

Polyimide stiffeners, epoxy rigidisers, and/or aluminium plates can be added to reinforce, or to increase thickness in selective areas of the circuit.

Double-Sided flexible circuits can be profiled by either soft tooling (steel rule die), hard tooling (compound press tool), or can be part profiled and supplied in a biscuit array.

A range of organic or metallic finishes can be applied depending on the end application such as tin/lead, electroless nickel/immersion gold, electrolytic nickel & gold, silver, palladium etc….

Flex-Rigid PTH circuits are made up from a single-sided flexible laminate bonded to a single-sided copper clad FR4 rigid board. These two materials are selectively bonded together using a thermosetting sheet cast adhesive. The panel is then drilled, electro-copper plated, image exposed on both sides and then chemical etched. The tracking on the flex side is then encapsulated with either a polyimide covercoat or a flexible photo-imageable solder resist. The tracking on the rigid side is generally coated with a photo-imageable solder resist, although a polyimide covercoat can be used.

Flex-Rigid PTH circuits can be profiled by either hard tooling (compound press tool), or can be cnc routed and supplied as single circuits or in a biscuit array.

A range of organic or metallic finishes can be applied depending on the end application such as tin/lead, electroless nickel/immersion gold, electrolytic nickel & gold, silver, palladium etc….

Flex-Rigid Multi-layers can be made up from many combinations of flexible layers and FR4 rigid layers. All inner layers are image exposed and chemical etched and then either visually inspected or tested prior to any other processing. These inner layers are then aligned onto each other using a pin registration system in order to achieve layer to layer alignment. Once inner/outer layers are Vacuum bonded and drilled (vias, component holes etc…) they are then processed through ‘Plasma desmear’. This process removes adhesive smear from within the hole wall and also provides a 3 point plating contact onto the inner layer. The outer layers are then electro-copper plated, image exposed and then chemical etched. The tracking on the outer layers is then generally coated with a photo-imageable solder resist (although a polyimide covercoat can be used).

Flex-Rigid Multi-layer circuits can be profiled by either hard tooling (compound press tool), or can be cnc routed and supplied as single circuits or in a biscuit array.

A range of organic or metallic finishes can be applied depending on the end application such as tin/lead, electroless nickel/immersion gold, electrolytic nickel & gold, silver, palladium etc….

Reverse-bared and Floating lead flexible circuits allow access to the conductors from both sides of the circuit and also a direct solder interconnection onto surface mount conductors or directly into through holes. It is recommended that the exposed conductor leads are surface bonded prior to any forming or bending operation.

These circuits are produced from a pre-drilled/punched polyimide covercoat laminate, bonded to a layer of pure copper foil. This laminate is then image exposed, chemical etched, and then encapsulated with either a top polyimide covercoat or a flexible photo-imageable solder resist.
Polyimide stiffeners, epoxy rigidisers, and/or aluminium plates can be added to reinforce, or to increase thickness in selective areas of the circuit.

Reverse-bared and Floating lead flexible circuits can be profiled by either soft tooling (steel rule die), hard tooling (compound press tool), or can be part profiled and supplied in a biscuit array.

A range of organic or metallic finishes can be applied depending on the end application such as tin/lead, electroless nickel/immersion gold, electrolytic nickel & gold, silver, palladium etc….